Daehyun Yoon1, Philip Lee2, Krishna Nayak3, and Brian Hargreaves1
1Radiology, Stanford University, Stanford, CA, United States, 2Electrical Engineering, Stanford University, Stanford, United Kingdom, 3Electrical and Computer Engineering, University of Southern California, Los Angeles, CA, United States
1Radiology, Stanford University, Stanford, CA, United States, 2Electrical Engineering, Stanford University, Stanford, United Kingdom, 3Electrical and Computer Engineering, University of Southern California, Los Angeles, CA, United States
We present
a novel spectrally-encoded multi-spectral imaging approach, denoted SEMSI, that
can correct for signal translation and pile-up artifacts near metallic implants
without the limitations of conventional view-angle tilting.
Figure 4. Comparison
of 2D SE, MAVRIC-SL, and SEMSI. Images on the same slice location by 2D
spin-echo (A), Product 3D MSI (MAVRIC-SL) (B), and the proposed SEMSI sequence
(C). The proposed SEMSI sequence achieves comparable off-resonance correction
with improved sharpness compared to the MAVRIC-SL sequence.
Figure 2. SEMSI
Image Reconstruction. The reconstructed slices images are first FFTed along the
echo time dimension after windowing to generate spectral images. Then based on
the center frequency of each spectral bin, the spectral images are
re-registered to its original location and combined to form the final image.
